e-ISSN 2320-2955, p-ISSN 2249-2569, ISBN 978-81-909047-9-7
PHARMACY | |
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Title | ANALYSIS OF ELECTRO-PLATING EFFLUENTS FOR FUNGAL DIVERSITY AND HEAVY METALS TOLERANCE |
Authors | Sweta Yadav, Dr. Neeta Sharma & Dr. Uma Shankar |
Page No | 83-88 |
Code | Int./JAN15/PH927 |
Affiliation | Lucknow University, INDIA |
Abstract | Considering the importance of filamentous fungi for bioremediation of electroplating efflux and contaminated soils, this study was planned to evaluate the metal tolerance potential of indigenous filamentous fungi. Fifteen fungal isolates were isolated from soils contaminated with electroplating effluent using serial dilution technique up to 10-2. The fungal isolates were screened for heavy metals nickel (Ni) and chromium (Cr) with varying concentration on potato dextrose agar media. Tolerance index were calculated to screen out fungus isolates for heavy metal tolerance. The results revealed that the Aspergillus niger was found most frequently occurring metal tolerant fungi with frequency 54% followed by Penicillium notatum 33% and Fusarium solani 13%. Tolerance ranged from 50 – 70 ppm for Ni and 60-70 ppm for Cr. The isolated fungi exhibiting great tolerance to metals (Ni and Cr) can be used successfully for bioremediation or bioabsorption of metals from electroplating efflux contaminated soil. |
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